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本次论坛介绍了新的晶圆代工技术和战略以及生态系统合作伙伴,
涵盖电子设计自动化 (EDA)、知识产权 (IP)、外包半导体组装和测试 (OSAT)、设计解决方案合作伙伴 (DSP) 以及云等领域。
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